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NVIDIA GeForce GT 415M: Release Date, Specs, and Performance

The NVIDIA GeForce GT 415M is a mobile graphics card released on September 3rd, 2010. It belongs to the Fermi architecture and is produced by TSMC on a 40 nm process size with 585 million transistors and a density of 5.0M / mm². The chip package used is BGA-973.

In terms of graphics processing, the GT 415M has a GPU clock speed of 500 MHz, a shader clock speed of 1000 MHz, and a memory clock speed of 800 MHz. It has 1024 MB of DDR3 memory and a memory bus width of 128 bits, providing a bandwidth of 25.60 GB/s.

The render configuration of the GT 415M includes 48 shading units, 8 texture mapping units, 4 raster operations pipelines, and 1 streaming multiprocessor. It also has a 64 KB L1 cache per streaming multiprocessor, and a 256 KB L2 cache.

In terms of theoretical performance, the GT 415M has a pixel rate of 1.000 GPixel/s and a texture rate of 4.000 GTexel/s. Its single precision computing power is 96.00 GFLOPS, and its double precision computing power is 8.000 GFLOPS.

The board design of the GT 415M is integrated graphics and has a thermal design power of 12 W. The outputs are dependent on the device it is installed in, and it does not require any power connectors.

As for graphics features, the GT 415M supports DirectX 12, OpenGL 4.6, and OpenCL 1.1. However, it does not support Vulkan, and its CUDA version is 2.1. It also has a shader model version of 5.1.

Some notes about the GF108 GPU used in the GT 415M include its release date, generation, predecessor and successor, which are all unknown. However, it has reached its end-of-life production.

Overall, the NVIDIA GeForce GT 415M is a mobile graphics card with decent performance and a low power consumption. It is suited for lightweight tasks and casual gaming, but may struggle with more demanding tasks. Its features and capabilities make it a suitable option for budget-friendly laptops.

NVIDIA GeForce GT 415M - Full Technical Specifications

Graphics Processor

GPU Variant N11P-GV
Architecture Fermi
Foundry TSMC
Process Size 40 nm
Transistors 585 million
Density 5.0M / mm²
Die Size 116 mm²
Chip Package BGA-973

Mobile Graphics

Release Date Sep 3rd, 2010
Production End-of-life
Bus Interface PCIe 2.0 x16

Clock Speeds

GPU Clock 500 MHz
Shader Clock 1000 MHz
Memory Clock 800 MHz

Memory

Memory Size 1024 MB
Memory Type DDR3
Memory Bus 128 bit
Bandwidth 25.60 GB/s

Render Config

Shading Units 48
TMUs 8
ROPs 4
SM Count 1
L1 Cache 64 KB (per SM)
L2 Cache 256 KB

Theoretical Performance

Pixel Rate 1.000 GPixel/s
Texture Rate 4.000 GTexel/s
FP32 (float) 96.00 GFLOPS
FP64 (double) 8.000 GFLOPS

Board Design

Slot Width IGP
TDP 12 W
Outputs Portable Device Dependent
Power Connectors None

Graphics Features

DirectX 12
OpenGL 4.6
OpenCL 1.1
Vulkan N/A
CUDA 2.1
Shader Model 5.1
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Kelvin Maina

Kelvin Maina is a dedicated content creator. He has a Bsc. Computer Science, and has worked for companies such as Investingcube.com, and cryptopolitan.com as a financial research analyst. At Shortfi, he mostly focuses on the latest technologies, gadgets, and technologies companies making progress in advancing humanity through innovation.

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