The AMD Ryzen™ 9 7945HX3D is a powerful mobile processor designed for high performance and efficiency. With its advanced specifications, impressive graphics capabilities, and innovative technology, this processor is ideal for both consumer and commercial use.
Equipped with a powerful AMD Radeon™ 610M graphics card, the Ryzen™ 9 7945HX3D offers a graphics frequency of 2200 MHz and 2 graphics cores, providing superior visual performance for a variety of tasks. In addition, the processor supports USB Type-C® DisplayPort™ Alternate Mode, allowing for seamless connectivity to external displays for an enhanced viewing experience.
One of the standout features of the AMD Ryzen™ 9 7945HX3D is its impressive memory capabilities. With a maximum memory of 64GB and support for DDR5 memory type, this processor is able to handle demanding workloads and multitasking with ease. It also supports NVMe boot, RAID0, RAID1, and RAID10, providing fast and efficient data storage options.
The Ryzen™ 9 7945HX3D boasts a respectable base clock of 2.3GHz and a maximum boost clock of up to 5.4GHz, making it one of the fastest and most responsive mobile processors on the market. With 16 CPU cores and 32 threads, it offers exceptional processing power for intensive tasks such as video editing, gaming, and 3D rendering.
This processor is also designed for seamless integration with the latest technologies. It supports PCIe® 5.0, the latest version of the PCI Express® protocol for high-speed data transfer, and features a native USB 2.0 port for easy connectivity to a wide range of devices. Furthermore, the Ryzen™ 9 7945HX3D supports Precision Boost 2 and Precision Boost Overdrive technology, providing intelligent and dynamic overclocking for improved performance.
The AMD Ryzen™ 9 7945HX3D processor is built with TSMC 5nm and 6nm FinFET technology, making it more power-efficient and eco-friendly. Additionally, its compact design with 3 package die counts and 122mm² I/O Die size allows for a smaller form factor, making it suitable for a wide range of laptop models.
This processor is also highly adaptable to different operating systems, with support for Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, and Ubuntu x86 64-Bit. However, availability may vary depending on the manufacturer.
In terms of security, the AMD Ryzen™ 9 7945HX3D offers advanced features such as AES, AMD-V, and SHA extensions, providing users with reliable and efficient data encryption options. It also supports AMD EXPO™ Memory Overclocking Technology for enhanced memory performance and precision.
With a default TDP of 55W, the Ryzen™ 9 7945HX3D strikes a balance between energy efficiency and high performance. Additionally, it offers a configurable TDP option of 55-75W for users who require more power.
The AMD Ryzen™ 9 7945HX3D is expected to launch on July 27, 2023, and will be available globally. Formerly codenamed "Dragon Range," this processor is part of the AMD Ryzen™ Processors product family, known for its exceptional performance and reliability.
In summary, the AMD Ryzen™ 9 7945HX3D is a top-of-the-line mobile processor that offers exceptional performance, unmatched memory capabilities, and advanced technology. It is designed for both consumer and commercial use, and is set to be one of the most sought-after processors in the market upon its release.
AMD Ryzen™ 9 7945HX3D:- Full Technical Specifications
Product IDs
| Product ID Tray | 100-000001086 |
|---|
Connectivity
| ECC Support | No |
|---|---|
| Max. Memory | 64GB |
| NVMe Support | Boot, RAID0, RAID1, RAID10 |
| Memory Channels | 2 |
| Native SATA Ports | 0 |
| System Memory Type | DDR5 |
| Max Memory by Socket | N/A |
| USB Type-C® Support | Yes |
| PCI Express® Version | PCIe® 5.0 |
| System Memory Subtype | SO-DIMM |
| Native USB 2.0 (480Mbps) Ports | 1 |
| Native PCIe® Lanes (Total/Usable) | 28 / 28 |
| Native USB 3.2 Gen 1 (5Gbps) Ports | 0 |
| Native USB 3.2 Gen 2 (10Gbps) Ports | 4 |
Graphics Capabilities
| Graphics Model | AMD Radeon™ 610M |
|---|---|
| Graphics Frequency | 2200 MHz |
| Graphics Core Count | 2 |
| Integrated Graphics | Yes |
| USB Type-C® DisplayPort™ Alternate Mode | Yes |
General Specifications
| L1 Cache | 1MB |
|---|---|
| L2 Cache | 16MB |
| L3 Cache | 128MB |
| Platform | Laptop |
| Base Clock | 2.3GHz |
| CPU Socket | FL1 |
| *OS Support | Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit, *Operating System (OS) support will vary by manufacturer. |
| Default TDP | 55W |
| Launch Date | 7/27/2023 |
| # of Threads | 32 |
| Architecture | "Zen 4" |
| Consumer Use | Yes |
| Product Line | AMD Ryzen™ 9 Processors with Radeon™ Graphics |
| # of CPU Cores | 16 |
| Commercial Use | No |
| Product Family | AMD Ryzen™ Processors |
| Former Codename | "Dragon Range" |
| Instruction Set | x86-64 |
| Max. Boost Clock | Up to 5.4GHz |
| Package Die Count | 3 |
| I/O Die (IOD) Size | 122mm² |
| AMD PRO Technologies | No |
| CPU Boost Technology | Precision Boost 2 |
| Multithreading (SMT) | Yes |
| Supported Extensions | AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 |
| Regional Availability | Global |
| Precision Boost Overdrive | Yes |
| CPU Compute Die (CCD) Size | 71mm² |
| AMD Configurable TDP (cTDP) | 55-75W |
| Curve Optimizer Voltage Offsets | Yes |
| Processor Technology for I/O Die | TSMC 6nm FinFET |
| Max. Operating Temperature (Tjmax) | 89°C |
| Processor Technology for CPU Cores | TSMC 5nm FinFET |
| AMD EXPO™ Memory Overclocking Technology | Yes |
