The AMD Ryzen™ 9 7950X3D, set to launch on February 28th, 2023, is the latest addition to the AMD Ryzen™ 9 Processor line. Designed for the enthusiast desktop market, this processor boasts impressive specifications and powerful features that guarantee superior performance.
With a base clock of 4.2GHz and a max boost clock of up to 5.7GHz, the Ryzen™ 9 7950X3D is built to handle even the most demanding tasks with ease. Its 16 CPU cores, 32 threads, and 128MB L3 cache allow for efficient multitasking and speedy processing, making it a perfect choice for gamers, content creators, and professionals alike.
One of the key features of the Ryzen™ 9 7950X3D is its compatibility with AMD's EXPO™ Technology and Ryzen™ Technologies. These cutting-edge technologies enhance the overall performance of the processor, delivering seamless operation and impressive graphics capabilities. The processor comes with AMD Radeon™ Graphics, with a graphics frequency of 2200 MHz and 2 graphics cores, providing a smooth and immersive visual experience.
In terms of connectivity, the Ryzen™ 9 7950X3D offers various options, including support for PCIe® 5.0, NVMe booting and RAID configurations, and USB Type-C® DisplayPort™ Alternate Mode. It also supports up to 128GB of DDR5 system memory and has a recommended liquid cooler for optimal performance.
The processor is based on the "Zen 4" architecture and utilizes TSMC's 5nm FinFET technology for its CPU cores and 6nm FinFET technology for its I/O die. The I/O die size is 122mm², while the CPU compute die size is 71mm², maximizing the efficiency and power of this impressive processor.
Moreover, the Ryzen™ 9 7950X3D is equipped with Precision Boost 2 and Precision Boost Overdrive technology, ensuring that the processor automatically adjusts its performance according to workload intensity, providing the best possible results.
The processor is compatible with various chipsets, including A620, X670E, X670, B650E, and B650, allowing for a flexible and customizable system build. Additionally, it offers support for various operating systems, including Windows 11, Windows 10, RHEL x86 64-Bit, and Ubuntu x86 64-Bit.
When it comes to thermal management, the Ryzen™ 9 7950X3D has a default TDP of 120W and a maximum operating temperature of 89°C. It also has an option for Curve Optimizer Voltage Offsets, providing users with the ability to fine-tune their system's voltage settings for better performance.
Overall, the AMD Ryzen™ 9 7950X3D is a top-of-the-line processor that offers advanced features and specifications to cater to the needs of the most demanding users. Its powerful performance, impressive connectivity options, and cutting-edge technologies make it an excellent choice for anyone looking for a high-performance processor. So, mark your calendars for February 28th, 2023, and get ready to experience the ultimate power and speed of the Ryzen™ 9 7950X3D.
AMD Ryzen™ 9 7950X3D:- Full Technical Specifications
Product IDs
| Product ID Tray | 100-000000908 |
|---|---|
| Product ID Boxed | 100-100000908WOF |
Connectivity
| ECC Support | Yes (Requires mobo support) |
|---|---|
| Max. Memory | 128GB |
| NVMe Support | Boot, RAID0, RAID1, RAID10 |
| Memory Channels | 2 |
| Max Memory Speed | N/A |
| Native SATA Ports | 0 |
| System Memory Type | DDR5 |
| USB Type-C® Support | Yes |
| PCI Express® Version | PCIe® 5.0 |
| System Memory Subtype | UDIMM |
| Native USB 2.0 (480Mbps) Ports | 1 |
| Native PCIe® Lanes (Total/Usable) | 28 / 24 |
| Native USB 3.2 Gen 1 (5Gbps) Ports | 0 |
| Native USB 3.2 Gen 2 (10Gbps) Ports | 4 |
| Additional Usable PCIe Lanes from Motherboard | N/A |
Key Features
| Supported Technologies | AMD EXPO™ Technology, AMD Ryzen™ Technologies |
|---|
Graphics Capabilities
| Graphics Model | AMD Radeon™ Graphics |
|---|---|
| Graphics Frequency | 2200 MHz |
| Graphics Core Count | 2 |
| Integrated Graphics | Yes |
| USB Type-C® DisplayPort™ Alternate Mode | Yes |
General Specifications
| L1 Cache | 1MB |
|---|---|
| L2 Cache | 16MB |
| L3 Cache | 128MB |
| Platform | Desktop |
| Base Clock | 4.2GHz |
| CPU Socket | AM5 |
| *OS Support | Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit, *Operating System (OS) support will vary by manufacturer. |
| Default TDP | 120W |
| Launch Date | 2/28/2023 |
| # of Threads | 32 |
| Architecture | "Zen 4" |
| Consumer Use | Yes |
| Product Line | AMD Ryzen™ 9 Processors |
| # of CPU Cores | 16 |
| Market Segment | Enthusiast Desktop |
| Product Family | AMD Ryzen™ Processors |
| Former Codename | "Raphael AM5" |
| Instruction Set | x86-64 |
| Max. Boost Clock | Up to 5.7GHz |
| Package Die Count | 3 |
| I/O Die (IOD) Size | 122mm² |
| Recommended Cooler | Liquid cooler recommended for optimal performance |
| Supporting Chipsets | A620, X670E, X670, B650E, B650 |
| AMD PRO Technologies | No |
| CPU Boost Technology | Precision Boost 2 |
| Multithreading (SMT) | Yes |
| Supported Extensions | AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 |
| Regional Availability | Global |
| Thermal Solution (PIB) | Not Included |
| Precision Boost Overdrive | Yes |
| CPU Compute Die (CCD) Size | 71mm² |
| AMD Ryzen™ Master Support | Yes |
| Curve Optimizer Voltage Offsets | Yes |
| Processor Technology for I/O Die | TSMC 6nm FinFET |
| Max. Operating Temperature (Tjmax) | 89°C |
| Processor Technology for CPU Cores | TSMC 5nm FinFET |
| AMD EXPO™ Memory Overclocking Technology | Yes |
