The Intel® Core™ i9-13900TE Processor is a high-performance processor designed for embedded applications. With a clock speed of up to 5.00 GHz and 36 MB of Intel® Smart Cache, it offers exceptional processing power and efficient multitasking capabilities. Its 24 cores and 32 threads make it ideal for demanding workloads, while its low TDP of 35 W ensures energy efficiency for long-term use.
The processor features Intel® UHD Graphics 770 with a base frequency of 300 MHz and support for up to 32 execution units. This allows for smooth graphics rendering and playback at high resolutions, with support for eDP 1.4b, DP 1.4a, and HDMI 2.1 outputs. Additionally, the processor supports Intel® Quick Sync Video, providing hardware-based video encoding and decoding for improved performance.
Built on the advanced 10nm Intel 7 process, this processor offers improved efficiency and performance compared to previous generations. It also supports up to DDR5 5600 MT/s memory and has a maximum memory size of 128 GB, making it suitable for memory-intensive applications.
For enhanced security and reliability, the processor includes features such as Intel® AES New Instructions, Intel® Virtualization Technology, and Execute Disable Bit. It also supports Intel vPro® Enterprise for remote management and Intel® Stable IT Platform Program for long-term stability.
Furthermore, the processor incorporates Intel® Deep Learning Boost and Gaussian & Neural Accelerator 3.0, providing advanced AI capabilities for optimized performance in AI workloads. It also supports advanced technologies such as Intel® Speed Shift, Turbo Boost, and Thread Director for efficient and dynamic performance.
The Intel® Core™ i9-13900TE Processor is expected to launch in Q1'23 and will be available for embedded applications. Its flexibility, performance, and advanced features make it a powerful choice for a variety of industrial and commercial use cases.
Intel® Core™ i9-13900TE Processor:- Full Technical Specifications
Essentials
| Lithography | Intel 7 |
|---|---|
| Use Conditions | Embedded Broad Market Commercial Temp |
| Processor Number | i9-13900TE |
Expansion Options
| PCI Express Revision | 5.0 and 4.0 |
|---|---|
| Max # of PCI Express Lanes | 20 |
| PCI Express Configurations | Up to 1x16+4, 2x8+4 |
CPU Specifications
| TDP | 35 W |
|---|---|
| Cache | 36 MB Intel® Smart Cache |
| Total Cores | 24 |
| Total Threads | 32 |
| Max Turbo Frequency | 5.00 GHz |
| Processor Base Power | 35 W |
| Processor Base Frequency | 1.00 GHz |
| Efficient-core Max Turbo Frequency | 3.90 GHz |
| Performance-core Max Turbo Frequency | 5.00 GHz |
Processor Graphics
| Execution Units | 32 |
|---|---|
| Graphics Output | eDP 1.4b, DP 1.4a, HDMI 2.1 |
| OpenCL* Support | 3.0 |
| OpenGL* Support | 4.5 |
| DirectX* Support | 12 |
| Processor Graphics | Intel® UHD Graphics 770 |
| Max Resolution (HDMI) | 4096 x 2160 @ 60Hz |
| Max Resolution (DP)‡ | 7680 x 4320 @ 60Hz |
| Graphics Base Frequency | 300 MHz |
| Intel® Quick Sync Video | Yes |
| Multi-Format Codec Engines | 2 |
| Graphics Max Dynamic Frequency | 1.65 GHz |
| Intel® Clear Video HD Technology | Yes |
| Max Resolution (eDP - Integrated Flat Panel)‡ | 5120 x 3200 @ 120Hz |
Advanced Technologies
| Intel® 64 | Yes |
|---|---|
| Idle States | Yes |
| Instruction Set | 64-bit |
| Intel® Thread Director | Yes |
| Instruction Set Extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Thermal Monitoring Technologies | Yes |
| Intel® Hyper-Threading Technology | Yes |
| Enhanced Intel SpeedStep® Technology | Yes |
| Intel® Gaussian & Neural Accelerator | 3.0 |
| Intel® Turbo Boost Max Technology 3.0 | No |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® Time Coordinated Computing (Intel® TCC) | Yes |
Memory Specifications
| Memory Types | Up to DDR5 5600 MT/s |
|---|---|
| ECC Memory Supported | Yes |
| Max Memory Bandwidth | 89.6 GB/s |
| Max # of Memory Channels | 2 |
| Max Memory Size (dependent on memory type) | 128 GB |
Package Specifications
| T | 100°C |
|---|---|
| Sockets Supported | FCLGA1700 |
| Thermal Solution Specification | PCG 2020C |
Security & Reliability
| Secure Key | Yes |
|---|---|
| Intel® Boot Guard | Yes |
| Execute Disable Bit | Yes |
| Intel vPro® Eligibility | Intel vPro® Enterprise |
| Intel® AES New Instructions | Yes |
| Intel® Total Memory Encryption | Yes |
| Mode-based Execute Control (MBEC) | Yes |
| Intel® Hardware Shield Eligibility | Yes |
| Intel® Standard Manageability (ISM) | Yes |
| Intel® Trusted Execution Technology | Yes |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® Stable IT Platform Program (SIPP) | Yes |
| Intel® Active Management Technology (AMT) | Yes |
| Intel® Control-Flow Enforcement Technology | Yes |
| Intel® VT-x with Extended Page Tables (EPT) | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) | Yes |
Supplemental Information
| Launch Date | Q1'23 |
|---|---|
| Embedded Options Available | Yes |
