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Qualcomm Snapdragon 6 Gen 1: Global 5G Connectivity & High-Performance Mobile Platform

The Snapdragon 6 Gen 1 mobile platform is the latest addition to Qualcomm's lineup of advanced mobile platforms. It is designed to provide truly global 5G connectivity with support for both Sub-6 and mmWave bands, including mmWave-sub6 dual connectivity. This makes it the first 3GPP Release 16 5G solution in the Snapdragon 6-series, ensuring seamless connectivity for users around the world.

The most notable feature of the Snapdragon 6 Gen 1 is its support for LP5, a first in the 6-series, which enables improved performance and power efficiency. It also supports TDD, FDD, and Dynamic Spectrum Sharing, allowing for global 5G coverage. In terms of performance, the Qualcomm Kryo CPU offers up to 35% improvement from the previous generation, while the Adreno GPU provides up to 30% performance improvement. The 7th Gen Qualcomm AI Engine and Qualcomm Hexagon Vector eXtensions (HVX) deliver highly responsive AI performance, with 3x better performance than the previous generation.

In terms of architecture, the Snapdragon 6 Gen 1 is the first in the 6-series to support Fuse Accelerator Architecture, offering improved performance without compromising battery life. It also features the Qualcomm Sensing Hub, which provides ultra-low power consumption for audio, voice, and sensors. This feature also supports multiple hardware-accelerated always-on voice assistants and features such as multi-mic far-field detection and noise cancellation.

The platform also features the Qualcomm Spectra Triple ISP, designed for concurrent multi-camera photo and video captures, making it the first computational HDR video capture in the 6-series, resulting in improved video quality. It also supports a 120fps FHD+ display for gorgeous display clarity and smooth UI and scrolling.

In terms of location tracking accuracy, the Snapdragon 6 Gen 1 offers Dual Frequency GNSS (L1 and L5) and Qualcomm Sensor Assisted Positioning for increased accuracy. It also features the Qualcomm FastConnect 6700 system, providing integrated Wi-Fi subsystem with the first Bluetooth 5.2 and WPA3 Security in the 6-series. It also features the first 802.11ax (Wi-Fi 6E) in the 6-series.

As for charging capabilities, the platform supports Qualcomm Quick Charge 4+ Technology, ensuring fast battery charging to keep users powered up. Other features include LPDDR5 memory with a speed of 3200 MHz, FHD+ @ 120 Hz maximum on-device display resolution, and USB 3.1 interface.

The Snapdragon 6 Gen 1 also boasts strong security features, including Qualcomm Trusted Execution Environment (TEE), Qualcomm Wireless Edge Services (WES), and Premium security features. It also features a Qualcomm Type-1 Hypervisor, ensuring secure data management.

In summary, the Snapdragon 6 Gen 1 mobile platform offers cutting-edge performance, global connectivity, and advanced features, making it an ideal choice for next-generation smartphones. With its advanced technology, the platform is set to redefine the mobile experience for users worldwide.

Snapdragon 6 Gen 1 Mobile Platform:- Full Technical Specifications

CPU

Name Qualcomm® Kryo™
Architecture 64-bit
Clock Speed Up to 2.2 GHz

GPU

Name Qualcomm® Adreno™
APIs OpenGL® ES 3.2, OpenCL™ 2.0 FP, Vulkan® 1.1

NFC

Near Field Communications Supported

Part

Part Number(s) SM6450

Audio

Qualcomm Aqstic™ technology support Qualcomm Aqstic™ audio codec, Qualcomm Aqstic™ smart speaker amplifier
Qualcomm® aptX™ audio technology support Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive, Qualcomm® aptX™ Lossless

Wi-Fi

Wi-Fi/Bluetooth System Qualcomm® FastConnect™ 6700
Peak Speed Up to 2.9 Gbps
Generation Wi-Fi 6E, Wi-Fi 4, Wi-Fi 6, Wi-Fi 5
Standards 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac, 802.11ax
Spectral Bands 6 GHz, 2.4 GHz, 5 GHz
Antenna Configuration 2x2
Peak QAM 4K QAM
Features MU-MIMO (UL/DL), OFDMA (UL/DL)

Camera

Image Signal Processor (ISP) Name Qualcomm® Spectra™
Image Signal Processor (ISP) Type Image Signal Processor (ISP)
Image Signal Processor (ISP) Number Triple ISP
Image Signal Processor (ISP) Bit Depth 12-bit
Single Camera (MFNR, ZSL, 30 fps) Up to 48 MP
Single Camera Up to 200 MP
Features Multi-frame Noise Reduction (MFNR), AI-Based De-Noising Engine (AIDE)
Video Capture Up to 4K @ 30 fps
Slow Motion Video Capture Up to 720p @ 240 fps
Video Capture Formats H.265 (High Efficiency Video Coding (HEVC)), H.264 (Advanced Video Coding (AVC))
Video Capture Features Triple staggered HDR sensor support

Memory

Speed 3200 MHz
Type LPDDR5

Display

Maximum On-Device Display Resolution FHD+ @ 120 Hz

Charging

Qualcomm® Quick Charge™ technology support Qualcomm® Quick Charge™ 4+ technology

Location

Location Support Qualcomm® Location Suite
Satellite Systems GLONASS, NavIC, Beidou, GPS, QZSS, Galileo
Frequency Support Dual (L1/L5)
Accuracy Lane-level, Sidewalk-level
Features Global Freeway Vehicle Navigation, Pedestrian Navigation

Security

Fingerprint Sensor Qualcomm® 3D Sonic Sensor Max, Qualcomm® 3D Sonic Sensor
Features Qualcomm® Trusted Execution Environment (TEE), Qualcomm® Wireless Edge Services (WES), Premium security features, Qualcomm® Type-1 Hypervisor, Platform Security Foundations

Bluetooth

Wi-Fi/Bluetooth System Qualcomm® FastConnect™ 6700
Specification Version Bluetooth® 5.2
Low Energy Features Bluetooth® Low Energy Audio
Features Dual Bluetooth® Antennas

Interfaces

Supported Interfaces USB-C, USB 3.1

Video Playback

Codecs Hybrid Log Gamma (HLG)

Cellular Modem-RF

Modem Name Snapdragon™ X62 5G Modem-RF System
Peak Download Speed Up to 2.9 Gbps
Cellular Modem-RF Specs 140 MHz bandwidth (Sub-6), 200 MHz bandwidth (mmWave), 2 carriers (mmWave)
Performance Enhancement Technologies Qualcomm® AI-Enhanced Signal Boost, Qualcomm® Wideband Envelope Tracking, Qualcomm® Smart Transmit™ 2.0 technology, Qualcomm® 5G PowerSave 2.0
Cellular Technology TD-SCDMA, NSA, HSPA, sub-6 GHz, Dynamic Spectrum Sharing (DSS), FDD, 5G mmWave, EV-DO, LTE support for CBRS, mmWave-sub6 aggregation, TDD, LTE, SA (standalone), WCDMA

Universal Serial Bus (USB)

Interface Type USB-C
Specification Version USB 3.1

Process Node and Technology

Process Node 4 nm

Qualcomm® Artificial Intelligence (AI) Engine

GPU Name Qualcomm® Adreno™
CPU Name Qualcomm® Kryo™
Qualcomm® Hexagon™ Processor Features Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX)
Qualcomm® Sensing Hub Features Qualcomm® Sensing Hub
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Kelvin Maina

Kelvin Maina is a dedicated content creator. He has a Bsc. Computer Science, and has worked for companies such as Investingcube.com, and cryptopolitan.com as a financial research analyst. At Shortfi, he mostly focuses on the latest technologies, gadgets, and technologies companies making progress in advancing humanity through innovation.

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