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Powerful and Efficient: Snapdragon 670 Mobile Platform - Details & Specs

The Snapdragon 670 Mobile Platform is a cutting-edge mobile processor designed to deliver powerful performance and advanced capabilities to mobile devices. With its advanced features and specifications, this mobile platform ensures a seamless experience for users across a wide range of applications.

The RF front-end features of the Snapdragon 670 include high-power transmit and Qualcomm® Adaptive Antenna Tuning, providing enhanced connectivity and network performance. The powerful Qualcomm® Kryo™ 360 CPU, clocked at up to 2 GHz, ensures smooth and efficient processing of tasks.

Featuring the Qualcomm® Hexagon™ 685 DSP, the Snapdragon 670 enables advanced machine learning and AI capabilities through its Qualcomm All-Ways Aware™ technology. The Qualcomm® Adreno™ 615 GPU provides optimal graphics performance, supporting popular APIs such as Vulkan®, OpenGL® ES 3.2, OpenCL™ 2.0, and DirectX® 12.

The Snapdragon 670 also supports NFC, making contactless payments and other interactions possible. It has a density of 8 GB RAM, ensuring fast and efficient multitasking capabilities. Its part number is SDM670, making it easily identifiable.

With Qualcomm Aqstic™ audio technology support, including Qualcomm Aqstic™ audio technology1 and Qualcomm® aptX™ audio technology, the Snapdragon 670 delivers immersive audio experiences. It also offers high-speed Wi-Fi with peak speeds of up to 867 Mbps, supporting Wi-Fi 4, Wi-Fi 5, and various other standards.

The camera capabilities of the Snapdragon 670 are equally impressive, with an Image Signal Processor (ISP) Name, Number, and Bit Depth of Qualcomm® Spectra™ 250, Dual ISP, and 14-bit, respectively. It supports up to 25 MP for single-camera capture, and up to 192 MP for overall imaging. It also features Accelerated Electronic Image Stabilization (AEIS) and can capture videos at 4K Ultra HD @ 30 fps, with slow-motion options of 720p @ 240 fps and 1080p @ 120 fps.

The Snapdragon 670 supports LPDDR4x type RAM with a speed of 1866 MHz, allowing for quick data transfers. It can also display content at FHD+ resolutions on-device and 4K Ultra HD when connected to an external display.

With Qualcomm® Quick Charge™ 4+ technology support, the Snapdragon 670 enables fast charging for compatible devices. It also supports Qualcomm® TrueWireless™ and Qualcomm® Broadcast Audio technology for efficient wireless audio playback and Bluetooth® 5.0 for fast and stable connections.

The Snapdragon 670 also has interfaces such as USB-C and USB 3.1, supporting various data transfer protocols and standards. It can even play videos at resolutions of up to 4K Ultra HD Premium @ 60 fps and features a Qualcomm® Snapdragon™ X12 LTE modem with peak download speeds of up to 600 Mbps and peak upload speeds of up to 150 Mbps.

This mobile platform also boasts advanced location support, satellite systems such as GLONASS, Beidou, SBAS, GPS, QZSS, and Galileo, and security features including Qualcomm® Mobile Security, Qualcomm® Processor Security, and Qualcomm® Content Protection.

With a focus on power efficiency, the Snapdragon 670 has impressive power consumption ratings, with 26 mW for high-performance audio playback and 0.65 mA for low-power voice activation. Its audio features include high-resolution playback and recording interfaces, USB-C support, and up to 4 W of amplifier output power for loud and clear audio.

The Snapdragon 670 is a 14 nm and 10 nm processor, ensuring efficient power usage and performance. It also supports up to 24-bit PCM and 192 kHz resolution, making it ideal for high-quality audio and voice applications. With its Qualcomm® Artificial Intelligence (AI) Engine, it provides advanced AI capabilities through its GPU, Hexagon

Snapdragon 670 Mobile Platform:- Full Technical Specifications

RF

RF Front-End (RFFE) Features High-power transmit (HPUE), Qualcomm® Adaptive Antenna Tuning

CPU

Name Qualcomm® Kryo™ 360
Architecture 64-bit
Clock Speed Up to 2 GHz

DSP

Name Qualcomm® Hexagon™ Vector Processor, Qualcomm® Hexagon™ 685
Features Qualcomm All-Ways Aware™ technology

GPU

Name Qualcomm® Adreno™ 615
APIs Vulkan®, OpenGL® ES 3.2, OpenCL™ 2.0, DirectX® 12

NFC

Near Field Communications Supported

RAM

Density 8 GB

Part

Part Number(s) SDM670

Audio

Qualcomm Aqstic™ technology support Qualcomm Aqstic™ audio technology1
Qualcomm® aptX™ audio technology support Qualcomm® aptX™ HD, Qualcomm® aptX™ Audio

Wi-Fi

Peak Speed Up to 867 Mbps
Generation Wi-Fi 4, Wi-Fi 5
Standards 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac
Spectral Bands 2.4 GHz, 5 GHz
Channels 160 MHz, 40 MHz, 20 MHz, 80 MHz
MIMO Configuration 2x2
Spatial Streams Up to 2
Peak QAM 256 QAM
Features LTE/Wi-Fi antenna sharing, Integrated baseband, MU-MIMO, Dual-Band Simultaneous (DBS)

Camera

Image Signal Processor (ISP) Name Qualcomm® Spectra™ 250
Image Signal Processor (ISP) Number Dual ISP
Image Signal Processor (ISP) Bit Depth 14-bit
Single Camera (MFNR, ZSL, 30 fps) Up to 25 MP
Single Camera (MFNR) Up to 48 MP
Single Camera Up to 192 MP
Features Accelerated Electronic Image Stabilization (AEIS)
Video Capture Up to 4K Ultra HD @ 30 fps
Slow Motion Video Capture Up to 720p @ 240 fps, Up to 1080p @ 120 fps
Video Capture Formats H.265 (High Efficiency Video Coding (HEVC))
Video Capture Features Motion Compensated Temporal Filtering (MCTF)

Memory

Speed 1866 MHz
Type LPDDR4x

Display

Maximum On-Device Display Resolution FHD+
Maximum External Display Resolution 4K Ultra HD
Pixels 2560 × 1600

Charging

Qualcomm® Quick Charge™ technology support Qualcomm® Quick Charge™ 4+ technology

Location

Location Support Sensor-assisted Positioning
Satellite Systems GLONASS, Beidou, SBAS, GPS, QZSS, Galileo
Features Low Power Geofencing and Tracking

Security

Features Qualcomm® Mobile Security, Qualcomm® Processor Security, Qualcomm® Content Protection

Bluetooth

Specification Version Bluetooth® 5.0
Topologies Qualcomm® TrueWireless™ technology, Qualcomm® Broadcast Audio technology
Classic Data Rate 2 Mbps

Interfaces

Supported Interfaces USB-C, USB 3.1

Video Playback

Resolution Up to 4K Ultra HD Premium @ 60 fps
Codecs H.264 (Advanced Video Coding (AVC)), VP9, VP8, H.265 (High Efficiency Video Coding (HEVC))

Cellular Modem-RF

Modem Name Qualcomm® Snapdragon™ X12 LTE modem
Peak Download Speed Up to 600 Mbps
Peak Upload Speed Up to 150 Mbps
Cellular Modem-RF Specs 3x20 MHz carrier aggregation (DL), 2x20 MHz carrier aggregation (UL), LTE Category 13 (UL), LTE Category 12 (DL)
Performance Enhancement Technologies Qualcomm® Snapdragon™ Upload+
Cellular Technology TD-SCDMA, LTE TDD, LTE Broadcast, CDMA 1x, EV-DO, WCDMA (DB-DC-HSDPA), Qualcomm® Snapdragon™ All Mode, GSM/EDGE, LTE FDD, WCDMA (DC-HSUPA)
Calling Services Ultra HD Voice (EVS), VoLTE with SRVCC to 3G and 2G, HD Voice, Voice over Wi-Fi (VoWiFi) with LTE call continuity
Multi SIM Dual SIM Dual VoLTE (DSDV)

Power Consumption

High Performance Audio Playback Down to 26 mW
Low power voice activation 0.65 mA

Audio Playback Interfaces

Sample Rate Up to 44.1 kHz
Dynamic Range Up to 130 dB
Total Harmonic Distortion + Noise (THD+N) Less than -109 dB
Amplifier Output Power Up to 4 W
Speaker protection Speaker protection

Audio Recording Interfaces

Resolution 24-bit
Sample Rate Up to 192 kHz
Dynamic Range Up to 109 dB
Total Harmonic Distortion + Noise (THD+N) Less than -103 dB

Universal Serial Bus (USB)

Interface Type USB-C
Specification Version USB 3.1

Process Node and Technology

Process Node 14 nm, 10 nm

Pulse Code Modulation (PCM)

Resolution 24-bit
Sample Rate Up to 192 kHz

Qualcomm® Artificial Intelligence (AI) Engine

GPU Name Qualcomm® Adreno™ 615
Qualcomm® Hexagon™ Processor Name Qualcomm® Hexagon™ 685
Qualcomm® Hexagon™ Processor Features Qualcomm® Hexagon™ Vector eXtensions (HVX)
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Kelvin Maina

Kelvin Maina is a dedicated content creator. He has a Bsc. Computer Science, and has worked for companies such as Investingcube.com, and cryptopolitan.com as a financial research analyst. At Shortfi, he mostly focuses on the latest technologies, gadgets, and technologies companies making progress in advancing humanity through innovation.

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