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Snapdragon 8 Gen 2 Mobile Platform - Powering the Future of Mobile Technology | Qualcomm

The Snapdragon 8 Gen 2 Mobile Platform from Qualcomm is a highly advanced and innovative mobile platform that takes mobile technology to the next level. Powered by the Qualcomm AI Engine, the platform offers unparalleled performance and efficiency with its Qualcomm Hexagon Processor. This is the first Snapdragon Mobile Platform to feature hardware-based micro tile inferencing, allowing for complex neural networks to be efficiently and accurately executed. The Hexagon Direct Link technology further enhances performance by providing a physical link between all cores, resulting in the highest level of performance.

Another revolutionary feature of the Snapdragon 8 Gen 2 Mobile Platform is the Qualcomm Sensing Hub, which includes dual-AI processors to power new experiences such as direct-to-app voice assistance and always-on and ultra-low power for audio, sensors, and always-sensing camera. The platform also supports all precisions, including INT4, INT8, INT16, and FP16. Additionally, the platform boasts our first-ever Cognitive ISP, the Snapdragon Sight™ Technology, which features real-time semantic segmentation for photo and video capture. It also includes an always-sensing camera with AI for quick and easy face detection and increased privacy, as well as a Bokeh Engine 2 that provides professional-level sharpness, color, and depth.

The Snapdragon 8 Gen 2 Mobile Platform is also a game-changer in the gaming industry, offering a full suite of Snapdragon Elite Gaming™ features. It sets the industry standard for real-time hardware accelerated ray tracing for improved lighting, shadows, and illumination. It is also the first Snapdragon Mobile Platform to support the Unreal Engine 5 MetaHumans framework for realistic human characters. With the new Qualcomm Kryo CPU, the platform boasts 40% more power efficiency, and the conversion of one of the efficiency cores into a performance core results in a more robust overall CPU configuration. Similarly, the Qualcomm Adreno GPU delivers up to 25% improved performance and 45% better power efficiency.

The Snapdragon 8 Gen 2 Mobile Platform supports Snapdragon Sound™ Technology, offering spatial audio with head tracking for complete surround sound immersion, ultra-low latency Bluetooth streaming, CD-quality lossless music streaming, and 32kHz super wideband voice call quality with aptX Voice. It also features the integrated Snapdragon X70 5G Modem-RF System, with blazing download speeds of up to 10 Gigabits per second for flawless entertainment and non-stop productivity. Other notable features of the platform include the Qualcomm FastConnect™ 7800 Mobile Connectivity System, which delivers the first announced Wi-Fi 7 commercial solution, and the Snapdragon Secure, which offers the latest security measures, including enhanced Face Unlock security system with liveness detection.

In conclusion, the Snapdragon 8 Gen 2 Mobile Platform is a comprehensive and cutting-edge mobile platform that sets a new standard for performance, efficiency, and innovation. With its advanced features and technologies, it is revolutionizing the mobile industry and creating endless possibilities for users and developers alike.

Snapdragon 8 Gen 2 Mobile Platform:- Full Technical Specifications

CPU

Name Qualcomm® Kryo™
Architecture 64-bit
Clock Speed Up to 3.36 GHz1

GPU

Name Qualcomm® Adreno™
APIs Vulkan® 1.3, OpenGL® ES 3.2, OpenCL™ 2.0 FP

NFC

Near Field Communications Supported

Part

Part Number(s) SM8550-AB, SM8550-AC1

Audio

Qualcomm Aqstic™ technology support Qualcomm Aqstic™ audio codec, Qualcomm Aqstic™ smart speaker amplifier
Qualcomm® aptX™ audio technology support Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive, Qualcomm® aptX™ Lossless
Audio Processing Technologies Snapdragon Sound™ technology

Wi-Fi

Wi-Fi/Bluetooth System Qualcomm® FastConnect™ 7800
Peak Speed Up to 5.8 Gbps
Generation Wi-Fi 4, Wi-Fi 6, Wi-Fi 5, Wi-Fi 7
Standards 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac, 802.11ax, 802.11be
Spectral Bands 6 GHz, 2.4 GHz, 5 GHz
Channels 320 MHz2
Peak QAM 4K QAM
Features Passpoint, TDLS, High Band Simultaneous (HBS) Multi-Link, Wi-Fi QoS Management, Wi-Fi Optimized Connectivity, MU-MIMO (UL/DL), Wi-Fi Aware R3, Wi-Fi Location, OFDMA (UL/DL), Miracast, Voice-Enterprise

Camera

Image Signal Processor (ISP) Name Qualcomm® Spectra™
Image Signal Processor (ISP) Type Hardware Accelerator for Computer Vision (CV-ISP), Cognitive ISP (Cog ISP), Image Signal Processor (ISP)
Image Signal Processor (ISP) Number Triple ISP
Image Signal Processor (ISP) Bit Depth 18-bit
Single Camera (MFNR, ZSL, 30 fps) Up to 108 MP
Single Camera Up to 200 MP
Features AI-based auto-exposure, Mega Low light photography, Engine for Visual Analytics 3.0, Multi-frame Noise Reduction (MFNR), AI-based face detection, Locally Motion Compensated Temporal Filtering (MCTF), Real-time Semantic Segmentation
Video Capture Up to 8K 30fps or 4K 120fps video capture
Slow Motion Video Capture Up to 720p @ 960 fps
Video Capture Formats Hybrid Log Gamma (HLG), Dolby Vision®, HDR10, HDR10+
Video Capture Features Engine for Visual Analytics 3.0, Up to 4 exposures (with QDOL image sensors), Video super resolution, Computational HDR with staggered imaged sensors, Real-time Semantic Segmentation, Bokeh Engine (version 2)

Memory

Speed 4200 MHz
Type LPDDR5x

Display

Maximum On-Device Display Resolution 4K Ultra HD @ 60 Hz, QHD+ @ 144 Hz
Maximum External Display Resolution 4K @ 60 Hz
High Dynamic Range (HDR) HDR Vivid, HDR10+, HDR10
Color Depth Up to 10-bit
Color Gamut Rec. 2020

Charging

Qualcomm® Quick Charge™ technology support Qualcomm® Quick Charge™ 5 technology

Location

Location Support Qualcomm® Location Suite
Satellite Systems GLONASS, NavIC, Beidou, GPS, QZSS, Galileo
Frequency Support Triple
Accuracy Lane-level, Sidewalk-level
Features Global Freeway Vehicle Navigation, Concurrent satellite systems, Pedestrian Navigation

Security

Fingerprint Sensor Qualcomm® 3D Sonic Sensor Max, Qualcomm® 3D Sonic Sensor
Secure Processing Unit (SPU) Biometric Authentication (Face), Biometric Authentication (Fingerprint), Biometric Authentication (Voice), Biometric Authentication (Iris)
Features Qualcomm® Trusted Execution Environment (TEE), Trust Management Engine, Qualcomm® Wireless Edge Services (WES), Qualcomm® Type-1 Hypervisor, Platform Security Foundations, Secure Processing Unit (SPU), Platform Security Foundations

Bluetooth

Wi-Fi/Bluetooth System Qualcomm® FastConnect™ 7800
Specification Version Bluetooth® 5.3
Topologies Dual Bluetooth® Radios
Low Energy Features Bluetooth® Low Energy Audio

Video Playback

Resolution Up to 8K @ 60 fps
Codecs Hybrid Log Gamma (HLG), HDR10+, AV1, H.264 (Advanced Video Coding (AVC)), VP9, VP8, Dolby Vision®, H.265 (High Efficiency Video Coding (HEVC)), HDR10
Features HDR Vivid

Cellular Modem-RF

Modem Name Snapdragon™ X70 5G Modem-RF System
Peak Download Speed Up to 10 Gbps
Peak Upload Speed Up to 3.5 Gbps
Cellular Modem-RF Specs 8 carriers (mmWave), 2x2 MIMO (mmWave), 4x4 MIMO (Sub-6)
Performance Enhancement Technologies Qualcomm® Smart Transmit™ 3.0 technology, Qualcomm® AI-Enhanced Signal Boost, Qualcomm® 5G Ultra-Low Latency Suite, Qualcomm® Wideband Envelope Tracking, Qualcomm® 5G AI Suite, Qualcomm® 5G PowerSave Gen 3
Cellular Technology TD-SCDMA, HSPA, sub-6 GHz, FDD, 5G mmWave, NSA (non-standalone), CDMA 1x, EN-DC, EV-DO, CBRS, NR-DC (mmWave-sub6 dual connectivity), TDD, LTE, GSM/EDGE, SA (standalone), SA (standalone) mmWave, WCDMA
Multi SIM Dual SIM Dual Active (DSDA) 5G+5G and 5G+4G, Global 5G Multi-SIM

Development Software

Development Artificial Intelligence (AI) Qualcomm® AI Stack

Universal Serial Bus (USB)

Interface Type USB-C
Specification Version USB 3.1

Process Node and Technology

Process Node 4 nm

Qualcomm® Artificial Intelligence (AI) Engine

GPU Name Qualcomm® Adreno™
CPU Name Qualcomm® Kryo™
Qualcomm® Hexagon™ Processor Features Qualcomm® Hexagon™ Tensor Accelerator, Dedicated power delivery system, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Micro Tile Inferencing, Fused AI Accelerator architecture, Hexagon Direct Link
Qualcomm® Sensing Hub Features Dual-core AI processor, Always-sensing camera
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Kelvin Maina

Kelvin Maina is a dedicated content creator. He has a Bsc. Computer Science, and has worked for companies such as Investingcube.com, and cryptopolitan.com as a financial research analyst. At Shortfi, he mostly focuses on the latest technologies, gadgets, and technologies companies making progress in advancing humanity through innovation.

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