The Snapdragon 8 Gen 3 Mobile Platform is a cutting-edge technology designed for mobile devices. It boasts several advanced features that make it stand out from other mobile platforms in the market.
One of its most impressive features is the Qualcomm® AI Engine. This engine is equipped with the Qualcomm® Hexagon™ NPU, which offers a 98% performance improvement compared to its predecessor. This allows for tasks like virtual assistants and chatbots to be performed on the device for enhanced security. Additionally, the upgraded Micro Tile Inferencing and Qualcomm® Sensing Hub provide always-on and ultra-low power capabilities for audio, sensors, and two always-sensing cameras. The platform also supports all precisions (INT4, INT8, INT16, FP16) for versatile usage.
The Qualcomm® Kryo™ CPU offers up to 30% improved performance and 20% more power efficiency. The upgraded CPU subsystem has converted an additional efficiency core into a performance core, resulting in a more robust overall CPU configuration. The Qualcomm® Adreno™ GPU delivers up to 25% improved performance and 25% better power efficiency. These improvements also contribute to up to 10% overall SoC power savings.
The platform also features the Qualcomm Spectra™ Cognitive ISP, which offers real-time semantic segmentation for photo/video frames with up to 12 layers. It also includes Dual Always-Sensing Cameras with AI for face detection and privacy protection. The Generative AI-powered voice-activated photo and video editing, night vision video capture, and HDR photo technology from Dolby provide incredible features for capturing and editing content. The platform also supports advanced functionalities such as Video Object Eraser, Photo Expansion, Truepic photo capture with C2PA standard support, and Vlogger’s View, which allows for sharing both the front and rear camera simultaneously.
For gaming enthusiasts, the Snapdragon 8 Gen 3 Mobile Platform offers a full suite of Snapdragon Elite Gaming™ features. This includes the industry standard for Real-time Hardware Accelerated Ray Tracing with improved lighting and shadows, Snapdragon Game Super Resolution, and support for the Unreal Engine 5.2 MetaHumans framework.
With the integrated Snapdragon® X75 5G Modem-RF system, the platform supports blazing download speeds of up to 10 Gigabits per second for effortless entertainment and constant productivity. The AI hardware acceleration also enhances the platform's 5G performance. The platform also offers 5G Dual-SIM Dual-Active (DSDA) for using two 5G+5G or 5G+4G SIM cards simultaneously for ultimate user flexibility.
Other features of the platform include triple frequency support for improved location accuracy, Qualcomm® Quick Charge™ 5 technology for fast charging, and Qualcomm® Location Suite for advanced location support. The platform also prioritizes security with features such as the Qualcomm® Trusted Execution Environment & Services, Trust Management Engine, and Secure Processing Unit.
The Snapdragon 8 Gen 3 Mobile Platform is powered by a 4 nm process node and features the Qualcomm® AI Stack, Qualcomm® Adreno™ GPU, Qualcomm® Kryo™ CPU, and Qualcomm® Hexagon™ processor. These components are designed to work seamlessly together to provide a powerful AI computing capability. Overall, the Snapdragon 8 Gen 3 Mobile Platform is a comprehensive and innovative technology that sets a new standard for mobile platforms.
Snapdragon 8 Gen 3 Mobile Platform:- Full Technical Specifications
CPU
Name | Qualcomm® Kryo™ |
---|---|
Architecture | 64-bit |
Clock Speed | 3.3 GHz |
GPU
Name | Qualcomm® Adreno™ |
---|---|
APIs | OpenGL® ES 3.2, OpenCL™ 2.0 FP, Vulkan® 1.3 |
NFC
Near Field Communications | Supported |
---|
Part
Part Number(s) | SM8650-AB |
---|
Audio
Qualcomm Aqstic™ technology support | Qualcomm Aqstic™ audio codec, Qualcomm Aqstic™ smart speaker amplifier |
---|---|
Qualcomm® aptX™ audio technology support | Qualcomm® aptX™ Lossless, Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive |
Audio Processing Technologies | Snapdragon Sound™ technology |
Wi-Fi
Wi-Fi/Bluetooth System | Qualcomm® FastConnect™ 7800 |
---|---|
Peak Speed | 5.8 Gbps |
Generation | Wi-Fi 7, Wi-Fi 6, Wi-Fi 5, Wi-Fi 4 |
Standards | 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a |
Spectral Bands | 6 GHz, 5 GHz, 2.4 GHz |
Channels | 320 MHz |
Peak QAM | 4K QAM |
Features | TDLS, Passpoint, High Band Simultaneous (HBS) Multi-Link, Wi-Fi Optimized Connectivity, MU-MIMO (UL/DL), Wi-Fi Aware R3, Wi-Fi QoS Management, Miracast, Wi-Fi Location, OFDMA (UL/DL), Voice-Enterprise, XPAN Technology |
Camera
Image Signal Processor (ISP) Name | Qualcomm® Spectra™ |
---|---|
Image Signal Processor (ISP) Type | Hardware Accelerator for Computer Vision (CV-ISP), Cognitive ISP (Cog ISP), Image Signal Processor (ISP) |
Image Signal Processor (ISP) Number | Triple ISP |
Image Signal Processor (ISP) Bit Depth | 18-bit |
Triple Camera (MFNR, ZSL, 30 fps) | 36 MP |
Dual Camera (MFNR, ZSL, 30 fps) | 64+36 MP |
Single Camera (MFNR, ZSL, 30 fps) | 108 MP |
Single Camera | 200 MP |
Features | Mega Low light photography, AI-based auto-exposure, AI-based auto-focus, AI-based face detection, Engine for Visual Analytics 3.0, Multi-frame Noise Reduction (MFNR), Locally Motion Compensated Temporal Filtering (MCTF), Real-time Semantic Segmentation, Truepic photo capture |
Video Capture | 8K 30fps or 4K 120fps video capture |
Slow Motion Video Capture | 720p @ 960 fps |
Video Capture Formats | Hybrid Log Gamma (HLG), Dolby Vision®, HDR10, HDR10+, Google Ultra HDR |
Video Capture Features | 4 exposures (with QDOL image sensors), Engine for Visual Analytics 3.0, Video super resolution, Computational HDR with staggered imaged sensors, Bokeh Engine (version 2), Real-time Semantic Segmentation |
Memory
Speed | 4.8 GHz |
---|---|
Type | LPDDR5x |
Display
Maximum On-Device Display Resolution | 4K Ultra HD @ 60 Hz, QHD+ @ 144 Hz |
---|---|
Maximum External Display Resolution | 8K @ 30 Hz |
High Dynamic Range (HDR) | HDR Vivid, HDR10, HDR10+ |
Color Depth | 10-bit |
Color Gamut | Rec. 2020 |
Storage
UFS | UFS 4.0 |
---|
Charging
Qualcomm® Quick Charge™ technology support | Qualcomm® Quick Charge™ 5 technology |
---|
Location
Location Support | Qualcomm® Location Suite |
---|---|
Satellite Systems | Galileo, Beidou, NavIC, GPS, GLONASS, QZSS |
Frequency Support | Triple |
Accuracy | Sidewalk-level, Lane-level |
Features | Pedestrian Navigation, Global Freeway Vehicle Navigation, Concurrent satellite systems |
Security
Fingerprint Sensor | Qualcomm® 3D Sonic Sensor, Qualcomm® 3D Sonic Sensor Max |
---|---|
Secure Processing Unit (SPU) | Biometric Authentication (Face), Biometric Authentication (Fingerprint), Biometric Authentication (Iris), Biometric Authentication (Voice) |
Features | Qualcomm® Type-1 Hypervisor, Qualcomm® Trusted Execution Environment & Services, Qualcomm® Wireless Edge Services (WES), Trust Management Engine, Secure Processing Unit (SPU), Platform Security Foundations |
Bluetooth
Specification Version | Bluetooth® 5.4 |
---|---|
Connection Technology | Bluetooth® Low Energy |
Video Playback
Resolution | 8K @ 60 fps |
---|---|
Codecs | H.265 (High Efficiency Video Coding (HEVC)), HDR10, Hybrid Log Gamma (HLG), Dolby Vision®, HDR10+, H.264 (Advanced Video Coding (AVC)), VP8, VP9, AV1 |
Features | HDR Vivid |
Cellular Modem-RF
Modem Name | Snapdragon™ X75 5G Modem-RF System |
---|---|
Peak Download Speed | 10 Gbps |
Peak Upload Speed | 3.5 Gbps |
Cellular Modem-RF Specs | 4x4 MIMO (Sub-6), 2x2 MIMO (mmWave), 8 carriers (mmWave) |
Performance Enhancement Technologies | Qualcomm® 5G Ultra-Low Latency Suite, Qualcomm® Smart Transmit™ Gen 4 technology, Qualcomm® 5G AI Suite Gen2, Qualcomm® 5G PowerSave Gen 4 |
Cellular Technology | sub-6 GHz, HSPA, TDD, LTE, WCDMA, FDD, SA (standalone), NSA (non-standalone), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE, EN-DC, CBRS, NR-DC (mmWave-sub6 dual connectivity), SA (standalone) mmWave, mmWave |
Multi SIM | Global 5G Multi-SIM, Dual SIM support Qualcomm® DSDA Gen 2 (Dual Data) |
Development Software
Development Artificial Intelligence (AI) | Qualcomm® AI Stack |
---|
Universal Serial Bus (USB)
Interface Type | USB-C |
---|---|
Specification Version | USB 3.1 Gen2 |
Process Node and Technology
Process Node | 4 nm |
---|
Qualcomm® Artificial Intelligence (AI) Engine
GPU Name | Qualcomm® Adreno™ |
---|---|
CPU Name | Qualcomm® Kryo™ |
Qualcomm® Hexagon™ Processor Features | Qualcomm® Hexagon™ Scalar Accelerator, Dedicated power delivery system, Qualcomm® Hexagon™ Tensor Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Micro Tile Inferencing, Fused AI Accelerator architecture, Hexagon Direct Link |
Qualcomm® Sensing Hub Features | Dual-core AI processor, Dual always-sensing cameras |