Send

Experience Unbeatable Performance with Snapdragon Wear 4100+ Platform

The Snapdragon Wear 4100+ Platform, designed by Qualcomm, is a revolutionary system-on-chip with powerful capabilities and enhanced features. It is a significant upgrade from the Snapdragon Wear 3100 platform, delivering a remarkable 85% increase in performance. With the ultra-low power co-processor, this platform can support up to 64K colors while also offloading more sensors to offer seamless, always-on experiences such as enhanced ambient mode, sports mode, and traditional watch mode.

One of the notable features of the Snapdragon Wear 4100+ Platform is its highly efficient event-driven RTOS, allowing for optimal workload partitioning and reducing power consumption by 25% compared to its predecessor. The platform also incorporates 12nm low power process technology and dual Qualcomm Hexagon DSP's, with one dedicated to modem and GPS functions, and the other focused on Open Sensor Execution Environment (SEE) and audio tasks.

Besides, this platform supports up to 16-megapixel cameras, providing exceptional camera capabilities on wearables. It is also equipped with Bluetooth 5.0 and Bluetooth 4.2, making it compatible with a wide range of devices. With a 4G modem approved by over 100 global network operators, the Snapdragon Wear 4100+ Platform offers unparalleled connectivity.

Looking at the specifications, the Snapdragon Wear 4100+ Platform boasts a powerful Arm® Cortex®-A53 Processor, with a clock speed of up to 2 GHz. It also features a Qualcomm® Hexagon™ QDSP6 V56, delivering superb performance. The Qualcomm® Adreno™ 504 GPU, with support for OpenGL® ES 3.1, provides stunning graphics for an immersive user experience.

The platform supports NFC and Qualcomm Aqstic™ technology, as well as Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology for audio. It also includes various wireless options such as Wi-Fi 4, LTE FDD, TD-SCDMA, GSM/EDGE, EV-DO, and LTE TDD. Additionally, it has comprehensive security features, including Qualcomm® Trusted Execution Environment (TEE)3 and Qualcomm® Processor Security.

The Snapdragon Wear 4100+ Platform supports various interfaces, including USB 2.0 and MIPI-DSI, and runs on the Wear OS operating system. It also includes advanced features like satellite and terrestrial location systems, LPDDR3 memory, and eMMC 4.5 storage options. Moreover, it is built with a 12nm process node, further enhancing its overall performance.

In conclusion, the Snapdragon Wear 4100+ Platform is an advanced and efficient system-on-chip designed to meet the demands of modern wearables. With its exceptional features and specifications, it is a game-changer in the industry, offering unparalleled performance and connectivity for a seamless user experience.

Snapdragon Wear 4100+ Platform:- Full Technical Specifications

CPU

Name Arm® Cortex®-A53 Processor
Clock Speed Up to 2 GHz

DSP

Name Qualcomm® Hexagon™ QDSP6 V56

GPU

Name Qualcomm® Adreno™ 504
APIs OpenGL® ES 3.1

NFC

Near Field Communications Supported

Audio

Qualcomm Aqstic™ technology support Qualcomm Aqstic™ audio codec
Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support Qualcomm® cVc™ Echo Cancelling and Noise Suppression
Audio Capturing Technologies Qualcomm® Voice Suite

Wi-Fi

Generation Wi-Fi 4
Standards 802.11a, 802.11b, 802.11g, 802.11n

Camera

Video Capture Up to 1080p @ 30 fps

Memory

Speed 750 MHz
Type LPDDR3

Storage

eMMC eMMC 4.5

Location

Satellite Systems Galileo, Beidou, GLONASS, GPS
Terrestrial Systems Cellular, Wi-Fi

Security

Features Qualcomm® Trusted Execution Environment (TEE)3, Qualcomm® Processor Security

Bluetooth

Specification Version Bluetooth® 4.21, Bluetooth® 5.02

Interfaces

Supported Interfaces USB 2.0, MIPI-DSI

Software Options

Operating System Wear OS

Cellular Modem-RF

Modem Name Qualcomm® Snapdragon™ Integrated X5 LTE Global Mode modem
Performance Enhancement Technologies Qualcomm® RF Front-End (RFFE) solution
Cellular Technology TD-SCDMA, GSM/EDGE, LTE FDD, EV-DO, LTE TDD

Universal Serial Bus (USB)

Specification Version USB 2.0

Process Node and Technology

Process Node 12 nm
Back to Products


About author

Kelvin Maina

Kelvin Maina is a dedicated content creator. He has a Bsc. Computer Science, and has worked for companies such as Investingcube.com, and cryptopolitan.com as a financial research analyst. At Shortfi, he mostly focuses on the latest technologies, gadgets, and technologies companies making progress in advancing humanity through innovation.

Scroll to Top